General information
Preparation of electronic devices
- Preparation of all devices for the manual assembly with special equipment and tools
- automatic facilities for cutting, flaring and folding of taped, axial and radial devices
Manual Assembly
- Universal assembly and repair workstations for PCB pattern and small series
- Assembly line for run production, soldering with wave-soldering machines also with protecting gas
Automatic SMD-assembly
- Boardloader and In-Line-Transport
- In-Line-screen printer
- Camalot-Dispenser with 25.000 Points/h (adhesive and soldering paste)
- One- and doublesided assembly with soldering paste-adhesive or soldering paste on both sides with 4 Mydata-Machines
- Chips from 0402 up to QFP 304 Pins/0,4 Pitch, max. edge length 56 mm
- Optical correctionsystem with fiducial marks
- Special form assembly
- Overal assembly performance 20.000 pcs/h
Automatic soldering
- 1 wave soldering machine for SMD- and THT
- Oblique transport
- sputter-fluxing machine with flow control
- soldering with protective gas
- computer-based soldering temperature profiles
- 2 convection reflow solder machines with protective gas
- 5 temperature zones with air recirculation of 6000 m³/h
- chain conveyor with max. speeds up to 2 m/min
Automatic testing
- 2 In-Circuit Testing machines with up to 800 test points
- performance test systems on IEC-BUS Base
- testlogging




